Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854912 | Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad | Joonsung Kim, Yonghwan Kwon | 2023-12-26 |
| 11726620 | Electronic device including grip sensor | Younghak PARK, Joosung KIM, Doil KU, Younggil Gi, Yonghee YANG +1 more | 2023-08-15 |
| 11728323 | Semiconductor package | — | 2023-08-15 |