Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791282 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Jaekyung Yoo, Yeongkwon Ko, Jaeeun Lee, Teakhoon Lee | 2023-10-17 |