JD

Jaydip Das

🗺 California: #26,301 of 67,585 inventorsTop 40%
Overall (2023): #411,831 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11843232 Assembly and method for sealing a bundle of wires Vijay Daga, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes 2023-12-12