Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11843232 | Assembly and method for sealing a bundle of wires | Vijay Daga, Jaydip Das, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes | 2023-12-12 |
| 11670437 | Assembly and method for sealing a bundle of wires | Sunny Sethi, Vijay Daga, Ting Gao | 2023-06-06 |