Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810876 | Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits | Michael D. Hodge, Justin Kim, Florian G. Herrault, Daniel S. Green | 2023-11-07 |
| 11811499 | Polarization-multiplexed self-homodyne analog coherent (PM-SH-ACD) architecture for optical communication links | Aaron Maharry, Hector Adolfo Andrade Paez, Clint L. Schow, Larry A. Coldren | 2023-11-07 |
| 11756848 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Isaac Rivera, Daniel S. Green | 2023-09-12 |
| 11652447 | Power amplifier | Kang Ning | 2023-05-16 |