Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830804 | Over and under interconnects | Belgacem Haba, Stephen L. Morein, Rajesh Katkar, Javier A. Delacruz | 2023-11-28 |
| 11830845 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2023-11-28 |
| 11824042 | 3D chip sharing data bus | Javier A. Delacruz, Steven Teig | 2023-11-21 |
| 11817409 | Directly bonded structures without intervening adhesive and methods for forming the same | Belgacem Haba, Rajesh Katkar, Javier A. Delacruz | 2023-11-14 |
| 11626363 | Bonded structures with integrated passive component | Belgacem Haba, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more | 2023-04-11 |
| 11557516 | 3D chip with shared clock distribution network | Javier A. Delacruz, Steven Teig, Eric Nequist | 2023-01-17 |