Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842937 | Encapsulation stack for improved humidity performance and related fabrication methods | Chris Hardiman, Kyle Bothe, Elizabeth Keenan | 2023-12-12 |
| 11842997 | Methods for pillar connection on frontside and passive device integration on backside of die | Terry Alcorn, Fabian Radulescu | 2023-12-12 |
| 11769768 | Methods for pillar connection on frontside and passive device integration on backside of die | Terry Alcorn, Fabian Radulescu | 2023-09-26 |
| 11587842 | Semiconductor die with improved ruggedness | Chris Hardiman, Kyoung-Keun Lee, Fabian Radulescu, Scott Sheppard | 2023-02-21 |