Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842997 | Methods for pillar connection on frontside and passive device integration on backside of die | Terry Alcorn, Daniel Namishia | 2023-12-12 |
| 11769768 | Methods for pillar connection on frontside and passive device integration on backside of die | Terry Alcorn, Daniel Namishia | 2023-09-26 |
| 11735538 | Semiconductor having a backside wafer cavity for radio frequency (RF) passive device integration and/or improved cooling and process of implementing the same | — | 2023-08-22 |
| 11682634 | Packaged electronic circuits having moisture protection encapsulation and methods of forming same | Kyle Bothe, Dan Namishia, Scott Sheppard | 2023-06-20 |
| 11658234 | Field effect transistor with enhanced reliability | Kyle Bothe, Terry Alcorn, Dan Namishia, Jia Guo, Matt King +4 more | 2023-05-23 |
| 11621322 | Die-to-die isolation structures for packaged transistor devices | Lei Zhao | 2023-04-04 |
| 11616136 | High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability | Kyle Bothe, Evan Jones, Dan Namishia, Chris Hardiman, Terry Alcorn +2 more | 2023-03-28 |
| 11587842 | Semiconductor die with improved ruggedness | Chris Hardiman, Kyoung-Keun Lee, Daniel Namishia, Scott Sheppard | 2023-02-21 |