Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784134 | Chip package and manufacturing method thereof | Shu-Ming Chang | 2023-10-10 |
| 11749618 | Chip package including substrate having through hole and redistribution line | Shu-Ming Chang | 2023-09-05 |