Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587881 | Substrate structure including embedded semiconductor device | Yu-Ju Liao, Chu-Jie Yang, Sheng-Hung Shih | 2023-02-21 |
| 11553596 | Embedded component package structure and manufacturing method thereof | Chien-Hao Wang | 2023-01-10 |