Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848280 | Method for manufacturing assembly structure by using frame structure on substrate | Wen-Hung Huang | 2023-12-19 |
| 11587881 | Substrate structure including embedded semiconductor device | Chien-Fan Chen, Chu-Jie Yang, Sheng-Hung Shih | 2023-02-21 |