Issued Patents 2023
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778767 | Mechanism for securing a printed circuit board to a bracket | Ta-Wei Chen, Chia-Chun Chen, Jyue HOU | 2023-10-03 |
| 11758677 | Facilitated expansion card removal | Hsin-Chieh Lin, Chih-Hao Chang, Yi-Fu Liu | 2023-09-12 |
| 11747873 | Removable combined PCIe riser bracket for computing device | Zhao-Hong Chen, Yi-Huang Chiu, Yu Ta Lin | 2023-09-05 |
| 11727529 | Application and integration of a GPU server system | Hsiao-Tsu Ni, Yaw-Tzorng Tsorng, Ta-Wei Chen | 2023-08-15 |
| 11719026 | Integrated latch mechanism for securing rackmount equipment in a chassis | Yaw-Tzorng Tsorng, Yao-Long Lin, You-Jin Liu | 2023-08-08 |
| 11698666 | Buckle base/fixing pin combination | Kai-Yuan CHUANG, Wei-Pin Chen, Jyue HOU | 2023-07-11 |
| 11700704 | Adjustable air blocks for cable routing | Yu-Syuan Lin, Ting-Kuang Pao, Yu Ta Lin | 2023-07-11 |
| 11690190 | System component carrier with ejector | Wei-Pin Chen, Kai-Yuan CHUANG, Jyue HOU | 2023-06-27 |
| 11683904 | Guide holders for engaging a motherboard sled with an input-output sled stacked thereon | Shih-Hsuan Hu, Cheng-Feng Tsai, Yu-Hsun Chen | 2023-06-20 |
| 11675398 | Snap rivets for securing printed circuit board assemblies | Kai-Yuan CHUANG, Wei-Pin Chen, Jyue HOU | 2023-06-13 |
| 11644875 | Lock mechanism for securing an expansion card in a computer chassis | Ting-Kuang Pao, Yu-Syuan Lin | 2023-05-09 |
| 11619981 | Damped tool-less cabled drive carrier | Wei-Pin Chen, Kai-Yuan CHUANG, Chin-Tien Huang | 2023-04-04 |
| 11598132 | Double shaft 180 degrees rotation sheet metal mechanism | Yaw-Tzorng Tsorng, Ching-Cheng Kung | 2023-03-07 |
| 11564325 | System chassis with raised sliding channel | Wei-Pin Chen, Ta-Wei Chen, Chin-Tien Huang | 2023-01-24 |
| 11558976 | Mechanical actuators for engaging a motherboard sled with a chassis | Shih-Hsuan Hu, Wei-Cheng Tseng, Cheng-Feng Tsai | 2023-01-17 |
| 11553625 | Tool-less M.2 device carrier with grounding and thermal flow | Shih-Hsuan Hu, Wei-Cheng Tseng, Cheng-Feng Tsai | 2023-01-10 |