Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723154 | Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package | Nicholas J. Chiolino, Matthew Barlow, Jacob Kupernik | 2023-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723154 | Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package | Nicholas J. Chiolino, Matthew Barlow, Jacob Kupernik | 2023-08-08 |