Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723154 | Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package | A. Matthew Francis, Matthew Barlow, Jacob Kupernik | 2023-08-08 |
| 11647582 | Rapid implementation of high-temperature analog interface electronics | Ian Getreu, James A. Holmes, Brandon Dyer, Jacob Kupernik, Matthew Barlow +1 more | 2023-05-09 |