Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832438 | Capacitor connections in dielectric layers | Travis W. Lajoie, Abhishek A. Sharma, Van H. Le, Chieh-Jen Ku, Pei-Hua Wang +13 more | 2023-11-28 |
| 11652047 | Intermediate separation layers at the back-end-of-line | Travis W. Lajoie, Abhishek A. Sharma, Van H. Le, Chieh-Jen Ku, Pei-Hua Wang +13 more | 2023-05-16 |
| 11610894 | Capacitor separations in dielectric layers | Travis W. Lajoie, Abhishek A. Sharma, Van H. Le, Chieh-Jen Ku, Pei-Hua Wang +13 more | 2023-03-21 |
| 11581162 | Fill pattern to enhance ebeam process margin | Shakul Tandon, Mark C. Phillips, John A. Swanson | 2023-02-14 |
| 11563107 | Method of contact patterning of thin film transistors for embedded DRAM using a multi-layer hardmask | Chieh-Jen Ku, Bernhard Sell, Pei-Hua Wang, Nikhil MEHTA, Shu Zhou +5 more | 2023-01-24 |