Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842943 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel +9 more | 2023-12-12 |
| 11543868 | Apparatus and method to provide a thermal parameter report for a multi-chip package | Tessil Thomas, Robin A. Steinbrecher, Michael Berktold, Timothy Y. Kam, Howard Chin +2 more | 2023-01-03 |