Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11842943 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel +9 more | 2023-12-12 | $45,136,000 |
| 11543868 | Apparatus and method to provide a thermal parameter report for a multi-chip package | Tessil Thomas, Robin A. Steinbrecher, Michael Berktold, Timothy Y. Kam, Howard Chin +2 more | 2023-01-03 | $15,575,000 |