Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11543868 | Apparatus and method to provide a thermal parameter report for a multi-chip package | Tessil Thomas, Sandeep Ahuja, Michael Berktold, Timothy Y. Kam, Howard Chin +2 more | 2023-01-03 |