Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798932 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Nicholas R. Watts | 2023-10-24 |
| 11705383 | Through mold interconnect drill feature | Rees WINTERS, Purushotham Kaushik Muthur Srinath | 2023-07-18 |