Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705383 | Through mold interconnect drill feature | Robert M. Nickerson, Rees WINTERS | 2023-07-18 |
| 11551956 | Method and device for failure analysis using RF-based thermometry | Chandrashekara Shashank Kaira, Phillip C. Miller, Deepak Goyal | 2023-01-10 |