Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837641 | Gate-all-around integrated circuit structures having adjacent deep via substrate contacts for sub-fin electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka +5 more | 2023-12-05 |
| 11824116 | Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka +5 more | 2023-11-21 |