Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824019 | Chip package with substrate integrated waveguide and waveguide interface | Tuncay ERDOEL, Ulrich Moeller, Bernhard Rieder, Ernst Seler, Maciej Wojnowski | 2023-11-21 |
| 11798874 | Semiconductor devices comprising electrical redistribution layer along with ground line and signal line and methods for manufacturing thereof | Francesca Arcioni, Tuncay ERDOEL, Vincenzo Fiore, Helmut Kollmann, Arif Roni +2 more | 2023-10-24 |
| 11791529 | Radio-frequency devices and associated production methods | Bernhard Rieder | 2023-10-17 |
| 11764453 | RF devices including an RF chip having an electrical redistribution layer with RF antennas formed therein and methods of manufacture | Bernhard Rieder | 2023-09-19 |