Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824019 | Chip package with substrate integrated waveguide and waveguide interface | Walter Hartner, Ulrich Moeller, Bernhard Rieder, Ernst Seler, Maciej Wojnowski | 2023-11-21 |
| 11798874 | Semiconductor devices comprising electrical redistribution layer along with ground line and signal line and methods for manufacturing thereof | Walter Hartner, Francesca Arcioni, Vincenzo Fiore, Helmut Kollmann, Arif Roni +2 more | 2023-10-24 |