Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11772187 | Ultrasonic welding device | Till Neddermann, Michal Chajneta | 2023-10-03 |
| 11756923 | High density and durable semiconductor device interconnect | Marian Sebastian Broll, Barbara Eichinger, Alexander Herbrandt | 2023-09-12 |