Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856718 | Housing for a power semiconductor module arrangement | Philipp Bräutigam, Andre Arens, Marco Ludwig | 2023-12-26 |
| 11756923 | High density and durable semiconductor device interconnect | Marian Sebastian Broll, Barbara Eichinger, Alparslan Takkac | 2023-09-12 |