Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839120 | Electronic device with conductive via structures | Wei-Chung Chen, Wen-Yu Kuo, Chieh-Wei Feng | 2023-12-05 |
| 11776920 | Capacitor and filter and redistribution layer structure including the same | Tzu-Yang Ting, Chieh-Wei Feng | 2023-10-03 |
| 11764166 | Semiconductor package structure | Jui-Wen Yang, Hsin-Cheng Lai, Chieh-Wei Feng, Yu-Hua Chung, Tzu-Yang Ting | 2023-09-19 |