HL

Hsin-Cheng Lai

IT ITRI: 1 patents #168 of 796Top 25%
TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #420,617 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11764166 Semiconductor package structure Jui-Wen Yang, Chieh-Wei Feng, Tai-Jui Wang, Yu-Hua Chung, Tzu-Yang Ting 2023-09-19