Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804442 | Combined backing plate and housing for use in bump bonded chip assembly | David W. Abraham, John M. Cotte | 2023-10-31 |
| 11735802 | Electroplated metal layer on a niobium-titanium substrate | Ryan T. Gordon, Yu Luo, Robert L. Sandstrom | 2023-08-22 |
| 11676903 | Combined backing plate and housing for use in bump bonded chip assembly | David W. Abraham, John M. Cotte | 2023-06-13 |