Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804442 | Combined backing plate and housing for use in bump bonded chip assembly | David W. Abraham, Shawn A. Hall | 2023-10-31 |
| 11676903 | Combined backing plate and housing for use in bump bonded chip assembly | David W. Abraham, Shawn A. Hall | 2023-06-13 |