JA

Joyce E. Molinelli Acocella

IBM: 1 patents #2,552 of 6,852Top 40%
📍 Poughquag, NY: #2 of 9 inventorsTop 25%
🗺 New York: #4,092 of 11,993 inventorsTop 35%
Overall (2023): #386,167 of 537,848Top 75%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11614324 Non-destructive bond line thickness measurement of thermal interface material on silicon packages Hongqing Zhang, Jay A. Bunt, David J. Lewison, Yu Luo 2023-03-28