Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11716808 | Tamper-respondent assemblies with porous heat transfer element(s) | Arthur J. Higby, David J. Lewison, Philipp K Buchling Rego, Jay A. Bunt, James A. Busby +1 more | 2023-08-01 |
| 11614324 | Non-destructive bond line thickness measurement of thermal interface material on silicon packages | Jay A. Bunt, David J. Lewison, Joyce E. Molinelli Acocella, Yu Luo | 2023-03-28 |