HY

Hongwen Yan

IBM: 2 patents #1,413 of 6,852Top 25%
TL Tokyo Electron Limited: 1 patents #287 of 865Top 35%
📍 Somers, NY: #11 of 33 inventorsTop 35%
🗺 New York: #2,120 of 11,993 inventorsTop 20%
Overall (2023): #150,342 of 537,848Top 30%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11844290 Plasma co-doping to reduce the forming voltage in resistive random access memory (ReRAM) devices Devi Koty, Qingyun Yang, Hiroyuki Miyazoe, Takashi Ando, Marinus Hopstaken 2023-12-12
11575077 Microfabricated air bridges for quantum circuits Vivekananda P. Adiga, John M. Papalia, David L. Rath, Jyotica V. Patel 2023-02-07