EP

Eric Nguyen Phan

IBM: 1 patents #2,552 of 6,852Top 40%
📍 Rochester, MN: #105 of 314 inventorsTop 35%
🗺 Minnesota: #2,421 of 6,752 inventorsTop 40%
Overall (2023): #452,335 of 537,848Top 85%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11641717 Soldering of end chip components in series John R. Dangler, Theron Lee Lewis, David J. Braun 2023-05-02