Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742602 | Press-fit rework method | John R. Dangler, Theron Lee Lewis | 2023-08-29 |
| 11733154 | Thermal interface material detection through compression | Theron Lee Lewis, John R. Dangler | 2023-08-22 |
| 11699884 | Electromagnetic shielding of heatsinks with spring press-fit pins | John R. Dangler, Timothy P. Younger, James D. Bielick, Stephen M. Hugo, Theron Lee Lewis +2 more | 2023-07-11 |
| 11647591 | Compliant pin surface mount technology pad for rework | Theron Lee Lewis, John R. Dangler | 2023-05-09 |
| 11641717 | Soldering of end chip components in series | John R. Dangler, Theron Lee Lewis, Eric Nguyen Phan | 2023-05-02 |
| 11555793 | Anti-vibration fixturing system for nondestructive testing | Theron Lee Lewis, John R. Dangler | 2023-01-17 |