HL

Hong Liu

Futurewei Technologies: 1 patents #18 of 93Top 20%
Foxconn: 1 patents #37 of 153Top 25%
HC Hongfujin Precision Electronics (Zhengzhou) Co.: 1 patents #5 of 26Top 20%
Overall (2023): #150,518 of 537,848Top 30%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11688704 Merged power pad for improving integrated circuit power delivery Shiqun Gu, Jinghua Zhu, Hongying Zhang, Jun Xia, Wangsheng Xie +3 more 2023-06-27
11682532 Electronic device, waterproof button structure, and waterproof partition Bo Yuan, Fu-Pin Hsieh, Hai-Tao Wang, ZHEN-HAI MEI 2023-06-20