Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11719584 | Complementary ring oscillators to monitor in-situ stress within integrated circuits | Hong Liu | 2023-08-08 |
| 11688704 | Merged power pad for improving integrated circuit power delivery | Jinghua Zhu, Hongying Zhang, Jun Xia, Wangsheng Xie, Shuangfu Wang +3 more | 2023-06-27 |
| 11545467 | IC die to IC die interconnect using error correcting code and data path interleaving | — | 2023-01-03 |