Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839023 | Three-dimensional molded circuit component | Satoshi Yamamoto, Akiko KITO, Hironori Ota, Hideto Goto, Naoki Usuki | 2023-12-05 |
| 11820063 | Manufacturing method and manufacturing device for foam molded article | Satoshi Yamamoto, Hideto Goto | 2023-11-21 |
| 11745312 | Clamping device | Masahiro Yasuda, Takuya Kawashima | 2023-09-05 |
| 11701806 | Resin component, and molding method and molding device for same | Taiki Moriizumi, Yuuki Kami, Noboru Hirano, Toshihiro Saimura, Hajime Miyamoto +1 more | 2023-07-18 |
| 11654839 | Resin molded article, molding device, and molding method | Kenichi Chujo, Yusuke Takamura, Hajime Miyamoto, Toshio Kazami, Satoru Iriyama +1 more | 2023-05-23 |
| 11648713 | Method for manufacturing foam molded body and foam molded body | Hideto Goto, Satoshi Yamamoto | 2023-05-16 |
| 11648718 | Resin molded article unit and method for molding resin molded article unit | Yusuke Takamura, Kenichi Chujo, Hajime Miyamoto, Toshio Kazami, Satoru Iriyama +1 more | 2023-05-16 |