Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839023 | Three-dimensional molded circuit component | Atsushi Yusa, Satoshi Yamamoto, Akiko KITO, Hironori Ota, Naoki Usuki | 2023-12-05 |
| 11820063 | Manufacturing method and manufacturing device for foam molded article | Atsushi Yusa, Satoshi Yamamoto | 2023-11-21 |
| 11648713 | Method for manufacturing foam molded body and foam molded body | Atsushi Yusa, Satoshi Yamamoto | 2023-05-16 |