Issued Patents 2023
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11559985 | Integrated circuit with address drivers for fluidic die | Scott A. Linn, James Michael Gardner | 2023-01-24 |
| 11548287 | Fluidic die assemblies with rigid bent substrates | Chien-Hua Chen | 2023-01-10 |
| 11541659 | Molded printhead | Silam J. Choy, Devin Alexander Mourey, Chien-Hua Chen | 2023-01-03 |