Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688764 | Semiconductor structure and method of forming same | Yu-Cheng Tung, Te-Hao Huang, Hsien-Shih Chu, Feng-Ming Huang | 2023-06-27 |
| 11678479 | Method of fabricating semiconductor device having void in bit line contact plug | Shi-Wei HE, Te-Hao Huang, Hsien-Shih Chu, Feng-Ming Huang | 2023-06-13 |