Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11678479 | Method of fabricating semiconductor device having void in bit line contact plug | Te-Hao Huang, Hsien-Shih Chu, Yun-Fan Chou, Feng-Ming Huang | 2023-06-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11678479 | Method of fabricating semiconductor device having void in bit line contact plug | Te-Hao Huang, Hsien-Shih Chu, Yun-Fan Chou, Feng-Ming Huang | 2023-06-13 |