Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11677135 | Packaged electronic device having integrated antenna and locking structure | Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2023-06-13 |
| 11658099 | Flip chip curved sidewall self-alignment features for substrate and method for manufacturing the self-alignment features | — | 2023-05-23 |