Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694946 | Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof | Hyung Jun Cho, Seung Woo Lee | 2023-07-04 |
| 11677135 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Seung-Mo Kim +1 more | 2023-06-13 |