Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756818 | Accommodating device for retaining wafers | Markus Wimplinger, Alexander Filbert | 2023-09-12 |
| 11742205 | Method and device for bonding of substrates | Andreas Fehkuhrer | 2023-08-29 |
| 11697281 | Device and method for bonding substrates | Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz | 2023-07-11 |
| 11680792 | Incoming runout measurement method | Frank Bogelsack | 2023-06-20 |