Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776842 | Method and device for surface treatment of substrates | — | 2023-10-03 |
| 11764198 | Method and device for bonding of chips | — | 2023-09-19 |
| 11756818 | Accommodating device for retaining wafers | Thomas Wagenleitner, Alexander Filbert | 2023-09-12 |
| 11697281 | Device and method for bonding substrates | Thomas Wagenleitner, Friedrich Paul Lindner, Thomas Plach, Florian Kurz | 2023-07-11 |
| 11562912 | Device and method for bonding of two substrates | Florian Kurz, Viorel Dragoi | 2023-01-24 |