Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735478 | System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers | Simone Frasca, Edoardo Charbon, Rebecca Leghziel | 2023-08-22 |