Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11845847 | Shaping powder | Hiroyuki Sendan, Yukihiro Fukagawa, Kenta Murayama, Tomohiro SHIROMARU, Toshio Miyatani +2 more | 2023-12-19 |
| 11555098 | Molding powder | Hirokazu Komori, Junpei Terada, Hiroyuki Sendan, Yukihiro Fukagawa, Kenta Murayama +4 more | 2023-01-17 |
| 11541573 | Thermoplastic resin pellet and method for manufacturing electric cable | Jihong Liu | 2023-01-03 |