Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11555098 | Molding powder | Junpei Terada, Hiroyuki Sendan, Tadahiro Yabu, Yukihiro Fukagawa, Kenta Murayama +4 more | 2023-01-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11555098 | Molding powder | Junpei Terada, Hiroyuki Sendan, Tadahiro Yabu, Yukihiro Fukagawa, Kenta Murayama +4 more | 2023-01-17 |