Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810789 | Method of fabricating a semiconductor substrate having a stressed semiconductor region | Shay Reboh, Victor Boureau, Francois Andrieu | 2023-11-07 |
| 11694991 | Method for transferring chips | Frank Fournel, Emilie Bourjot, Severine Cheramy, Loic Sanchez | 2023-07-04 |
| 11688811 | Transistor comprising a channel placed under shear strain and fabrication process | Emmanuel Augendre, Maxime Argoud, Pierre Morin, Raluca Tiron | 2023-06-27 |