Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715710 | Method of treatment of an electronic circuit for a hybrid molecular bonding | Emilie Bourjot, Amandine Jouve, Christophe Dubarry | 2023-08-01 |
| 11710653 | Method for manufacturing a handle substrate intended for temporary bonding of a substrate | Pierre Montmeat, Paul Alan Stewart | 2023-07-25 |
| 11694991 | Method for transferring chips | Emilie Bourjot, Severine Cheramy, Sylvain Maitrejean, Loic Sanchez | 2023-07-04 |
| 11575063 | Method for fabricating a detection device comprising a step of direct bonding of a thin sealing layer provided with a getter material | Sébastien Becker | 2023-02-07 |
| 11569115 | Temporary bonding method | Pierre Montmeat, Laurent Bally, Thierry Enot | 2023-01-31 |
| 11562899 | Method for transferring thin layers | Pierre Montmeat | 2023-01-24 |
| 11551976 | Thin-film transfer method | Laurent Michaud, Pierre Montmeat | 2023-01-10 |