Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756861 | Thermal packaging with fan out wafer level processing | Matthew J. Traverso, Sandeep Razdan, Joyce Peternel, Aparna R. PRASAD | 2023-09-12 |
| 11668875 | Periscope optical assembly with inserted components | Matthew J. Traverso | 2023-06-06 |